2014 JSPE Autumn Conference
Session ID : A34
Conference information
Host: The Japan Society for Precision Engineering
Relationship between Polishing Apparatus Phenomena and Polishing Characteristics in Si-Chemical Mechanical Polishing
Effect of Polishing Characteristics by Mechanical and Chemical Actions
Michio Uneda, *Yoshihiro Takahashi, Kazutaka Shibuya, Yoshio Nakamura, Daizo Ichikawa, Ken-ichi Ishikawa
Author information
Keywords:
Polishing,
Removal Rate,
Slurry Particle Concentration,
Coefficient of Friction,
Polishing Pad Surface Temperature
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