サファイア電界CMP用複合砥粒の開発と研磨特性

川原 浩一; 鈴木 俊正; 須田 聖一; 池田 洋; 中村 竜太; 久住 孝幸; 赤上 陽一

doi:10.11522/pscjspe.2014A.0_437

2014 JSPE Autumn Conference

Session ID : I15

DOI https://doi.org/10.11522/pscjspe.2014A.0_437

Conference information

Host: The Japan Society for Precision Engineering

Development of Composite Abrasives for Sapphire CMP with AC Electric Field and Its Polishing Properties

*Koichi Kawahara, Toshimasa Suzuki, Seiichi Suda, Hiroshi Ikeda, Ryuta Nakamura, Takayuki Kusumi, Yoichi Akagami

Author information

Keywords: sapphire polishing, composite abrasives, CMP with AC Electric Field

CONFERENCE PROCEEDINGS FREE ACCESS

Details

Abstract

Extremely smooth surface and high polishing rate are required for polishing of sapphire substrates for LED. In this study, we synthesized the composite abrasives that composed of SrTiO₃ and SiO₂ in order to develop the suitable abrasives for AC electric polishing of sapphire substrates. The developed abrasives showed higher polishing rate than a commercial colloidal silica slurry under the same polishing conditions of AC electric polishing.

Corresponding author

Register with J-STAGE for free!