2014 JSPE Spring Conference
Session ID : D20
Conference information
Host: The Japan Society for Precision Engineering
Relationship between Polishing Apparatus Phenomena and Polishing Characteristics in Chemical Mechanical Polishing
Effect of Slurry Particle Concentration in Si-CMP
Michio Uneda, *Yoshihiro Takahashi, Kazutaka Shibuya, Yoshio Nakamura, Daizo Ichikawa, Ken-ichi Ishikawa
Author information
Keywords:
Polishing,
Removal Rate,
Abrasive Concentration,
Coefficient of Friction,
Multiple Correlation Analysis
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