Wearing of Single Crystal Diamond Cutting Tool During the Ultra-precision Machining Process for Adhesive Plastic Materials

Abstract

For space-saving of the electronic circuit board, lamination techniques by conjugation of the electronic circuit board have been attracting attention. During the bonding of thermosetting resin with adhesiveness, ultra-precision machining process using diamond tool is performed to flatten the resin surface. However, the behavior of rapid wear in tool is revealed in processing for adhesive resin. The objective of this study is to develop the measures of preventing wear in single crystal diamond tool and to survey the speed of tool wear base on the cutting atmospheric conditions such as low temperature, low oxygen.