Abstract
We have tried to process many materials by acting the deoxidization/oxidization reactions of electron and hole provided by irradiating an ultraviolet ray on photocatalyst and fluorescent substance, and by applying the mechanical scratching action of photocatalyst and abrasive grit. The future of U-RAM depends on the settlement of the subject whether this technology well processes pure metal, alloy and inorganic compound etc, practically. The issues what kinds of materials the U-RAM well process, or why the U-RAM can/cannot process the materials remain. The chemical reaction is much in polishing the easy-oxidized materials of copper, nickel, aluminum titanium and iron etc. The use of Al2O3 for that of TiO2 cannot bring the flat surface. Easy flattening of bearing steel is due to easy oxidation/dissolution. It is possible to flatten stainless steel, even if the passive film forms. Though cobalt/cobalt alloys are the difficult-oxidized materials, the decomposition of Cathilon in ultraviolet-ray irradiation acts to oxidize/dissolve them. The nitride becomes as flat as the grain boundary of crystals appears, though it is the very difficult-oxidized material. The U-RAM is difficult to apply for processing diamond.
