2016 JSPE Spring Conference
Session ID : E67
Conference information
Host: The Japan Society for Precision Engineering
Relationship between Polishing Pad Surface Asperity and Removal Rate at Chemical Mechanical Polishing of Hard-to-Process Material
*Takahiro Matsunaga, Michio Uneda, Kazutaka Shibuya, Yoshio Nakamura, Daizo Ichikawa, Ken-ichi Ishikawa
Author information
Keywords:
Hard-to-Process Material,
Chemical Mechanical Polishing,
Removal Rate,
Pad Surface Asperity,
Conditioning
Details
