2016 JSPE Spring Conference
Session ID : H78
Conference information
Host: The Japan Society for Precision Engineering
Development of wafer-level packaging technology of AlN piezoelectric device
*Ryo Ohta, Takeshi Harada, Daiji Noda, Masaaki Amikura, Akihisa Ueno, Masao Arakawa
Author information
Keywords:
wafer-level packaging,
plasma surface activated low temperature bonding,
Au-Au Bonding,
hermetic sealing
Details
