抄録
During copper chemical mechanical polishing (CMP) process, large amount of contamination residues on polished surface as removing of great number of copper. The common contaminations such as abrasives, metallic ion, and organic compound, that will discourage the metallic line of fabrication, even result in decline of efficiency. Benzotriazole(BTA) is known as passivation behavior that combined with metallic surface forming the protective layer from the serious corrosion, but it indicates a feature hard to be removed comprehensively in the general cleaning solution, for example water, ethanol, and acetone…etc. Polyhydroxylated fullerene, called fullerenol, as the outstanding nanoparticle is utilized in biomedicine, material science, and precision engineering fields according to its water-solubility, medicinal chemistry, and cage structure. This study aims to introduce the diluted fullerenol solution to remove the remained BTA film in post cleaning system. The 20mm in square of copper specimen is treated by 0.05M BTA solution for 2 min, and then dipped into diluted fullerenol solution for 2 min. Finally, it is measured by x-ray photoelectron spectroscopy (XPS), to observe the signal from 1s orbital of nitrogen. The results show the N1s peak (˜400eV) is decrease even disappears after treated by diluted fullerenol solution (0.01wt%, 0.05wt%, and 0.1wt%).
