Proceedings of JSPE Semestrial Meeting
2017 JSPE Spring Conference
Session ID : N39
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Development of the bipolar electrostatic chuck module having beam assembly microstructure using lithographic technique
*Seungman ChoiPasomphone HemthavyKunio TakahashiKento KawanoShigeki Saito
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Abstract
A microfabricated bipolar Electrostatic Chuck (ESC) which has array of beam assembly is able to manipulate a dielectric object with continuously changing curvature such as plastic film, fabric, and others by using electrostatic force. In this study, the fabrication method using lithography technique including multiple dry etching processes with a single etching mask for three-layer types module (conductor-dielectrics-conductor) was proposed for development of the device. In addition, it was clarified that wet etching process was better than dry etching process for a dielectric layer to prevent thermal deformation of Photo Resist (PR). We expect laminated modules of ESC are effective to manipulate object with large surface.
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© 2017 The Japan Society for Precision Engineering
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