Abstract
The fine ceramics used for electronic and mechanical component parts are generally manufactured through sintering, then processed to obtain expected dimensions by grinding. There are many factors involved in a grinding process such as types of grinding wheels, dressing and grinding conditions, etc. Those factors affect the grinding performance in a complex way. This experiment was conducted in order to improve the performance of the grinding process. In the experiment, the types of grinding wheels and dressing conditions were taken as control factors, the grinding wheel moving distance which changes the amount ground as the signal factor, and the materials to be processed such as alumina and silicon, whose hardness is quite different, were considered as the noise factor.From the experiment, a significant improvement was obtained after optimization.
