Abstract
IC fabrication system involves six sub-processes: resist-spin-coating, exposure, development, descurnming, metal-evaporation, and resist-patterns-removal, ln order to optimize the whole fabrication system, the methods of quality engineering were utilized. ln this study two signal factors were used to develop the generic function of product and the process engineering simultaneously. The SN ratios and sensitivity indexes were used for the optimization. As a result, the standard deviation was reduced to one half in the initial condition. Thus the developrnent of technology of fine line fabrication and the establishment of the product engineering are done effectively.
