抄録
With the advancement of electronic and electrical components, higher density printed circuit boards are on the way. ln order to competitive, it is essential to optimize the robust functions for future boards. ln the past, we have been using quality characteristics such as "Bridge" and "Non - soldering" to evaluate performance of soldering. This time, we have conducted a parameter design to study the robustness of basic function of soldering process. We were able to develop technology for future soldering process. The details are reported hereafter.
