抄録
Numerical analysis of bonded area at diffusion bonding was indicated by Takahashi at Quarterly Journal of the JWS (1985). Relationship between percent bonded area by this analysis and joint strength for diffusion bonding of ultra fine machined copper was evaluated. Bonding parameters are low temperature (473∼973 K) and extensive low pressure (0.005∼0.15 MPa). Details of bonding test were reported by authors at Quarterly Journal of the JWS (1997).Main results are as follows:
(1) It was confirmed that percent bonded area with numerical analysis proposed by Takahashi were nearly equivalent to the ratio of joint strength/copper base metal strength. The ratio of joint strength/copper base metal strength is 95∼100% when percent bonded area with numerical analysis is 100% and 7∼14% over than percent bonded area with numerical analysis at another case.
(2) This numerical analysis is effective for practical use at diffusion bonding of ultra fine machined copper by low bonding temperature and pressure.
