ガルウィング型リードのソルダリング接合部のヒール部でのフィレットの形成度合の検出プロセスの検討
レーザ照射型熱画像法によるマイクロ接合部欠陥検出に関する研究(第3報)
1994 年 12 巻 3 号 p. 451-456
詳細
1994 年 12 巻 3 号 p. 451-456
Detection process on the degree of fillet formation at the micro soldered joints of QFP lead has been researched and developed. The shape of the joints is expressed by three parameters (fillet length, average thickness of solder, angle of flat part of lead). The fillet length can be detected by temperature of three part on the surface of lead (toe part, center part, bend part), furthermore both average thickness of solder, and angle of flat part of lead can be detected by them. This detection process is investigated by the computer simulation on thermal model of the joint of QFP between copper alloy lead with 150μm thickness and glass epoxy substrates (1.6 mm thickness).
