抄録
The evaluation of an interface migration for the diffusion bonding process in which the temperature continuously changed was examined based on the kinetics and the Ni diffusion at the bonding interface of dissimilar materials of both carbon-steel/ Ni and ferritic stainless steel/austenitic stainless steel. On the bonding interface of SUS444/316L the γ phase was transformed into the a phase by Ni diffusion from the γ phase to the α phase side. The distance of interface migration was obtained analytically from the balance of Ni atoms that enter and exit at the interface. An interface migration in the case of multistep and continuous cooling was confirmed to be predicted from the calculation of an interface migration in the state of constant temperature.
