溶接学会論文集
Online ISSN : 2434-8252
Print ISSN : 0288-4771
低温金錫接合法による銅箔リードの微細接合とその信頼性
LSIリードフレーム材料の接続に関する研究(第5報)
御田 護志田 朝彦
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ジャーナル フリー

1999 年 17 巻 2 号 p. 326-333

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This report considers the low melting point Au-Sn microsoldering (utilizing the Au 10 mass %-Sn eutectic ; melting point/ 490 K, bonding heat tool temperature/523 K and bonding time/5 s) which is applied to the 400-600 pin count and 0.10-0.15 mm lead pitch connection with 0.018 mmt thin copper lead. This method is performed by heat and press tool gang bonding of tin electroplated (3.5, μ mthick) copper pattern on substrate and gold electroplated (0.5, μm thick) thin copper lead with non flux in air. Au-Sn microsoldered layer has the high peel strength and has the high reliability in 218 K×30 min-423 K×30 min temperature cycle test and 423 K storage test in air that is higher than 37 mass % Pb-Sn microsoldering. As a result of this reserch, it is determined that the low melting point Au-Sn microsoldering is an excellent method for thin copper lead micro connection to the copper pattern routed substrate and the board.

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