接触子の接合部品質と蒸気シールド方式の採用による品質改善効果

非鉄金属の抵抗熱源応用蒸気シールド加圧接合法及びその品質のインプロセス制御に関する研究(第3報)

抄録

Contact-bars of electromagnetic switchgears are required high precision and high quality at bonds. For the purpose, Vapor Shielded Pressure Bonding process and its in-process control system are successfully developed
To control the material deformation, characteristics by resistance heating while bonding are examined, and the optimum electrode materials and their constitution are selected for the joint couple of Ag-Cu in diskshape as described in the report-1 and report-2.
In this study, resistance heating is tried to bond the contact-bar which consists of Ag contact (φ4×t2mm) and carrier bar of 2.5%Fe-Cu material(w5×127×t0.7mm), and bonding quality is mainly examined.
Then, it is clarified that the newly developed vapor shield process can be effectively applied to secure the high quality bonds.
The results obtained are as follows;
1)Electrode constitution accomplished in former report can be applied to bond contact-bars.
2)Samples bonded in air atmosphere are fractured at bonding interface by peel test because of their lower bonding quality.
3)Micro inclusion is observed at the bonding interface.
4)It is clarified by EPMA inspection that the micro inclusion is FeO.
5)Torn samples bonded under vapor shield show Ag fractured mode stably because of improved high quality bonds.