リード・厚膜間電圧による接合界面温度の計測

マイクロソルダリング接合部品質のインプロセス制御(第一報)

抄録

Temperature at the joint interface is able to be measured by detecting the voltage between copper alloy lead and thick film on alumina substrate in micro-soldering process.
Temperature at the interface of soldered joint is very important quantity for quality of soldered joint. But it is too difficult to measure the temperarture at the interface of micro-soldered joint, because of its size being too small. It is found that the voltage occurs between copper alloy lead and thick film on substrate during reflow soldering process using heated tip and, furthermore, it is shown that the voltage is proportional to the temperature at soldered interface of the joint. As a result, the temperature of the joint interface of can be easely measured by detecting the voltage between lead and thick film during micro-soldering process.