Abstract
Recently, the density of the electric parts mounted on the printed circuit board (PCB) has become very high because of the rich function of the electric products. Especially, mobile products are required compactness and thinness, so the LSIs with chip size package and the key switches have to be mounted on the same PCB. When over loads applied to the key switches, the LSIs on the PCB may be damaged.Today, the structure analysis is used widely for evaluation and validation of the mechanical design. However, electric engineers do not use the structure analysis because of the lack of the knowledge on the mechanical engineering.To solve this problem, the authors developed the semi-automated analysis system for the evaluation of the strength of the PCB. In this paper, modeling method for the analysis and the experimental results are described.
