ゲル電解質を用いた銅めっき
III. 薄膜ゲル電解質による銅電析

抄録

The electroplating of copper has been done by using a thin film of gel electrolyte. The electrochemical behavior of the copper plating cell was investigated by electrochemical methods involving an impedance method. The current efficiencies of both copper deposition and copper counter electrode dissolution did not depend on the thickness of the gel electrolyte. It was confirmed that the copper plating could be accomplished using a gel electrolyte of 1mm thickness. The cell voltage increases due to solution resistance with the increase of gel electrolyte thickness. Therefore, decrease of electrical power requirement and minimization of the plating cell can be expected by electroplating using a thin gel electrolyte.