はんだフラックスを内包するマイクロカプセルとスズの複合めっき

抄録

Microcapsules containing abietic acid, which is the main ingredient of the flux for the solder plating, were incorporated with tin electrodeposition. The microcapsules containing abietic acid were fabricated by the polymerization between the oil-soluble and water-soluble monomers. The incorporation of the microcapsules in the tin film was confirmed by surface observation with a confocal laser scanning microscope. Furthermore, the dispersibility of the microcapsules in the plating bath was investigated. It was found that the dispersibility of microcapsules involving fluorobenzene was superior, since the ratio of the specific gravity of the microcapsule to the plating bath was close to unity. As a result, the stable incorporation of microcapsules could be carried out by the present plating method.