表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
研究論文
水溶液中での銅のアノード溶解反応に及ぼす塩化物イオンと硫酸イオンの影響
板垣 昌幸柴田 靖裕渡辺 邦洋町澤 健司
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2004 年 55 巻 8 号 p. 549

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The influences of chloride and sulfate ions in natural aqueous solution on the anodic dissolution of copper were investigated using electrochemical techniques. The anodic dissolution mechanisms of copper were proposed using determining the reaction parameters by the anodic polarization curves. The valencies of the copper ions were also determined using channel flow double electrode.
The anodic dissolution mechanism changed depending on the concentrations of chloride and sulfate ions in fresh water : specifically, between (1) a concentration range with trace amounts of chloride and sulfate ions, and (2) a concentration range with more than about 100ppm of chloride and sulfate ions. The anodic polarization curve didn't show pH dependence in concentration range (2), but did show pH dependence in concentration range (1). The anodic dissolution mechanisms in concentration range (2) are proposed to be as follows.
In the chloride medium :
Cu+Cl=CuCl+e
CuCl+Cl→CuCl2
In the sulfate medium :
Cu+SO42−=CuSO4ads+e
Cu+CuSO4ads+2SO42−
→CuSO4ads+Cu(SO4)22−+2e
Cu(SO4)22−=Cu2++2SO42−
The influence of silica in fresh water on the anodic polarization curve was discussed.

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© 2004 一般社団法人 表面技術協会
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