表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
技術論文
銅電析による微細孔埋め込みにおけるアセトニトリルの役割
小野 俊昭薦田 康夫板垣 昌幸
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ジャーナル フリー

2007 年 58 巻 12 号 p. 851

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Copper electrodeposition from the electrolyte composed of acid copper sulfate and acetonitrile was investigated with electrochemical techniques. The current efficiency of the copper electrodeposition was measured by the rotating disk electrode, and it was found that the current efficiency decreased with the increase of the rotation rate and the decrease of current density. These results indicated that the electrodeposition with the electrolyte composed of acid copper sulfate and acetonitrile was able to fill the Vias with copper by selecting of the proper flow rate and current density.
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© 2007 一般社団法人 表面技術協会
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