抄録
This paper addresses a new method of surface patterning for thin aluminum films using photolithography, anodization, and chemical etching. Aluminum film with a thickness of about 150nm was deposited on titanium-coated silicon or slide glass substrates. Subsequently, square masks were patterned on the aluminum film using photolithography. While aluminum film was anodized in 1vol% sulfuric acid, an anodic oxide film formed in the photoresist/aluminum film interface in addition to on open surface regions. In this process, the thickness of the anodic oxide film formed under the photoresist was affected by the bath voltage and the thickness of the titanium layer. Since the thickness of the anodic oxide at open surface regions and at masked regions differed, a patterned surface was developed. In order to examine the surface morphology, the anodic oxide film was removed by chemical etching in 21vol% phosphoric acid. As result, the anodic oxide film was removed, leaving an aluminum film of convex shape on the substrate.
