抄録
A printed circuit board with a fine Cu pattern was fabricated by electroless plating and laser irradiation. A glass fiber-reinforced epoxy resin plate was immersed in a Pd2+ solution and a Cu layer was then deposited on the epoxy resin by Cu electroless plating. After Cu plating, the Cu deposited specimen was irradiated with a pulsed Nd-YAG laser through an iris diaphragm and a convex lens to remove the Cu layer locally in air or doubly distilled water. The width of the Cu removed area increased with increasing the laser power and with decreasing the scanning rate of the laser beam. When laser irradiation was performed in doubly distilled water, the Cu layer around the laser-irradiated area rolled up, resulting in the formation of less precise patterns. Fine Cu-pattern coils with 60 μm width and 20 μm intervals were fabricated on the epoxy resin by laser irradiation in air.
