抄録
A PdCl2/SnCl2 mixed catalyst is generally used for the initiation of or pretreatment for electroless copper plating on non-conductive substrates. However, this procedure has become expensive because of the increase in the cost of a Pd metal. Furthermore, the remains of Pd on a substrate surface induce electrical problems in fine and dense circuit patterns. In this study, we have developed a new catalyzing process using a mixture of copper and tin salts instead of the Sn-Pd mixed catalyst. This catalyst has showed much the same performance as the Sn-Pd catalyst, where a uniform copper film was deposited on an epoxy resin. An adhesion strength larger than 1.0kN/m was achieved. The new catalyst process is suitable for forming fine line patterns without extraneous deposition since copper is easily removed from the resin surface.
