表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
技術論文
電解銅箔における異常粒子析出の発生機構の解析
四反田 功小野 智人板垣 昌幸渡辺 邦洋小浦 延幸山口 智寛
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2009 年 60 巻 1 号 p. 56

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Abnormal grain growth occurring on an electrodeposited copper film was investigated for defect prevention during electrolytic copper foil production. An electrodeposited copper film was formed on a titanium substrate. Then abnormal grain growth was observed using scanning electron microscope equipped with an energy dispersive X-ray spectrometer (SEM-EDX) and X-ray diffraction (XRD). Generation of abnormal grains depended on the method of pretreatment of the titanium substrate. Titanium particles generated by mechanical polishing during the pretreatment process were related to the abnormal grain growth. The preferred orientation of copper near titanium particle differed from that in the other parts of the film. Titanium particles were found to be involved in abnormal grain growth.

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© 2009 一般社団法人 表面技術協会
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