抄録
For evaluation of the microstructure between Pb-free solder alloy and a Ni-P coating layer, the spatial resolution of a field emission electron probe microanalyzer (FE-EPMA) was measured using interfacial morphologies of GaP/InAlP of light emitting diode (LED). The Ni was alloyed with Sn, producing an approximately 300-nm-thick P-rich layer.
