抄録
Currently, the main method used to maintain adhesion between Cu and insulating material （resin） on PWB is forming roughness on a Cu surface using chemical etching and acquisition of adhesion by the anchor effect. We conducted an examination with the intention of using the technology to maintain sufficient adhesion with the etching solution that forms fine roughness by approximately 1/10 of the etching amount of a conventional micrometer-order etching solution.
