Direct Fabrication of Metal Patterns on Resin Substrate by Combining Imprint and Electrochemical Lithography

抄録

We report a new patterning method to fabricate metal patterns on polyimide substrate with trench structure by combining imprint and electrochemical lithography. Using an ion-doped precursor polyimide films with trench structure prepared by imprint lithography, metal thin films can be successfully deposited at convex portion of trench structure through electrochemical and ion-exchange reactions, which resulted in the generation of metal patterns on polyimide films. The present process is quite simple, which can be performed without resist coating, exposure and etching. Therefore, the study provides effective methodology for fabrication of flexible printed circuit boards.