2016 年 67 巻 4 号 p. 211-216
This work systematically examined the development of a new plating bath for fine-patterned manganese electrochemical deposition on an organic substrate under various conditions. Hull cell tests, potentiodynamic scans, and galvanostatic experiments conducted with widely diverse pH and current densities revealed that CyDTA played a critical role as a pH buffer in the formation of fine-patterned manganese films. Optimized plating conditions enabled the formation of fine-patterned manganese electrochemical deposits of 10 μm squares with 20 μm pitch.