銅電析皮膜の結晶組織とエッチング液の添加剤種によるエッチファクターへ与える影響

抄録

Effects of crystals of the electrodeposited copper film and additive species of the etching solution on etching behavior were investigated to improve the etching factor during wet etching using the subtractive method. Regarding the crystal plane of the copper electrodeposited film, the crystal orientation of the electrodeposited copper film showed random orientation when the current density was swept from 100 mA to 10 mA. The crystallite became smaller. Effects of etching factor improvement were found by using FeCl₃ （aq）as an etchant and by adding azoles, especially triazoles. Triazoles were adsorbed onto the specific lattice. Etching was controlled to improve the etching factor.