Preparation of Low-resistive and Adhesive Metallic Cu layer on Glass Substrate by Chemical Reactions

Abstract

A metallic Cu layer was fabricated on a glass substrate using chemical bath deposition of Cu（OH）₂/Cu（O,S）bilayer in aqueous solutions containing copper（II）nitrate hydrate, ammonium nitrate, and thiourea or urea, followed by chemical reduction in a sodium borohydride solution. The Cu layer possessed resistance of 0.68 Ω/□ and maximum peeling strength of 13.4 N/cm.