ピンホール試験の採点法について

抄録

Pin holes of film produced in plating are generally observed by measuring their number and size, but it is very troublesome to do so. Therefore, a new method to measure pin holes, checker board-like sieve method, was introduced. By this method, it is found that the pin holes can be measured more speedly and accurately. By regulating the size of sieve, the errors of this measurements can be decreased.