抄録
The mechanism of adhesion between coated film and substrate (base metal) processed by electro-plating, hot dipping, flame spray coating, vapor plating, etc. was semi-quantitatively observed by means of X-ray microanalyzer. The results obtained within the analyzing limit of the microanalyzer were as follows:
(1) Each adhesion of electroplated Ni or Cr film on Fe substrate and electroplated Cr film on Ni substrate was considered to be simple mechanical bonding.
(2) Each adhesion of hot dipped film on Cu or Fe substrate and hot dipped Zn film on Fe substrate was found to be the bonding by mutual diffusion, because deep diffusion layer was observed. Furthermore, it was found in soldering that diffusing power of Sn in soft solder was more effective than that of Pb.
(3) In regard to metallikons, adhesion of flame-coated Zn or Cu film on Fe substrate was mechanical bonding; however, in Mo metallikon, slight diffusion bonding was observed between the substrate and coated film.
(4) In plasma-flamed WC film on the plasma-flamed undercoating of Al (20%) and Ni (80%) covering Fe substrate (steel plate) was found that Ni partly diffused into both substrate and WC film, but some of Ni was alloyed which strengthened the adhesion of the both films.
(5) In vapor plated TiC layer on steel plate processed by thermal decomposition of mixed vapor of TiCl4 and toluene at 1200°C, the boundary layer between substrate and coated TiC was completely alloyed and the thickness of alloyed layer was considerably large which permitted the presence of pure TiC layer only near the surface.
