抄録
The composition and temperature of electroless copper plating baths were investigated by means of design of experiment for the purpose of clarifying the effects of the above factors on the deposition rate of copper and the decomposition in the bath.
Tartrate or EDTA was used as a complexing agent. The deposition rate of copper in such a bath depended upon temperature, concentrations of copper ion and formaldehyde, and the interaction between temperature and copper ion concentration. However, the deposition of copper from EDTA bath greatly depended upon temperature and concentration of copper ion, but slightly upon other factors. Whereas, the deposition from tartrate bath fairly depended upon concentration of formaldehyde and the interaction between temperature and copper ion concentration as well as other factors.
The decomposition in EDTA bath depended upon pH as well as temperature, concentrations of copper ion and formaldehyde, the effects of the four factors were nearly in the same degree. In addition, the decomposition rate was increased with the increase of pH value.
