抄録
It is known that the ductility of electroless plated copper is improved by the addition of cyanide compounds to the plating bath. However, the details of that phenomenon are not yet clarified.
Studies were made on the effects of various factors such as sorts and amounts of cyanide compounds and bath temperature on the ductility of plated copper.
The results obtained were summarized as follows:
1) Copper depcsits of high ductility were obtained from the baths containing above 10-4mol/l of NaCN or K2[Ni(CN)4]⋅H2O and above 10-2mol/l of K4[Fe(CN)6]⋅3H2O or K3[Co(CN)6] at60-90°C. However, the deposits obtained from these baths at below 60°C showed little ductility.
2) In the deposits obtained from the baths containing various amounts of a same sort of cyanide at the same temperature, an approximately linear relation was found between the deposition rate and the ductility.
3) It was shown by the results of electron microscopic examination and X-ray analysis that there were no significant differences in structures between the ductile copper from the baths at high temperatures and the brittle copper from the baths at low temperatures.
