Au films were prepared on iron substrate by electroless plating using Al as a galvanic contact material, and their formation mechanism and morphology were studied by direct examinaticn and diffraction of electron microscope.
The results obtained were as follows:
1) The coherencies found between initial Au crystals and Fe substrate were as follows.
(1){(001) Fe||(001) Au [110] Fe||[010] Au (2){(110) Fe||(110) Au [001] Fe||[110] Au
With the lapse of plating time, crystal orientations different from such coherencies were observed in some parts.
2) The coherency between Au-particles of under 100Å in diameter and iron substrate had already been found. In the early stage, these Au-particles were separated one another; but with the lapse of time, they were combined and developed to network structure. Sometimes, micro-twins or moiré patterns were observed in the connecting parts of network structure.
3) Extra reflections due to double diffraction were observed in the diffraction patterns of Au plate crystals. They were explained as follows: there was co-existence of two or more Au crystals having different orientations.
4) Micro-twins and rotating moiré patterns were observed in the electron micrographs of Au plate crystals. The micro-twins contributed to the relaxation of stress due to lattice defects of Au crystals. The rotating moiré patterns indicated the rotation of Au crystals in the plate crystal and the rotation contributed to the relaxation of stress in the crystal.

抄録全体を表示

It is known that the ductility of electroless plated copper is improved by the addition of cyanide compounds to the plating bath. However, the details of that phenomenon are not yet clarified.
Studies were made on the effects of various factors such as sorts and amounts of cyanide compounds and bath temperature on the ductility of plated copper.
The results obtained were summarized as follows:
1) Copper depcsits of high ductility were obtained from the baths containing above 10^-4mol/l of NaCN or K₂[Ni(CN)₄]⋅H₂O and above 10^-2mol/l of K₄[Fe(CN)₆]⋅3H₂O or K₃[Co(CN)₆] at60-90°C. However, the deposits obtained from these baths at below 60°C showed little ductility.
2) In the deposits obtained from the baths containing various amounts of a same sort of cyanide at the same temperature, an approximately linear relation was found between the deposition rate and the ductility.
3) It was shown by the results of electron microscopic examination and X-ray analysis that there were no significant differences in structures between the ductile copper from the baths at high temperatures and the brittle copper from the baths at low temperatures.

抄録全体を表示