抄録
The leveling power of plating solution is closely related to the microprofile of the substrate, and thus should be evaluated in relation to the geometric leveling action. Two models for the geometric leveling proposed by Dohi and by Müller et. al. were compared on the diagrams which universally show the relation between the leveling power and the plating thickness as a function of the angle of the groov. The leveling action in various nickel plating baths were also studied on these diagrams, and the changes of leveling power with plating thickness obtained in these practical platings were observed to be coincident with the changes of geometric leveling power calculated with the different groov angles by using Dohi's model. Thus the geometric leveling by Dohi was considered to be more general as a fundamental model to evaluate the leveling power of practical plating.
