表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
金の電析反応における金属不純物の挙動
山下 嗣人伊藤 政昭岩城 泰彦荒巻 芳幸
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1989 年 40 巻 11 号 p. 1297-1299

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The influence of metallic additives on the electrodeposition of gold has been studied by the impedance method.
The electrodeposition rate of gold was influenced when additives were included in the electrolyte, but the rate-determining step in the processes of gold deposition was scarcely influenced. The gold deposition was controlled by the chargetransfer reaction.
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