反応性イオンプレーティングによるTiN薄膜の配向性, モルフォロジーおよびその特性

抄録

TiN films were prepared by reactive ion plating, and the influence of preparation conditions (nitrogen pressure, substrate bias voltage and ionization current) on their crystal orientation, morphology and properties was investigated. The orientation and morphology of the films were characterized by X-ray diffraction and scanning electron microscopy (SEM). The orientation of TiN films changed from (111) to (200) as the bias voltage and ionization current increased. The intensity of the (200) peak decreased as the nitrogen pressure increased. The Vickers microhardness and wear resistance of the films increased with increases in bias voltage and ionization current. TiN films that were deposited at a high bias voltage, high ionization current and low nitrogen pressure showed good corrosion resistance. The properties of those films which exhibited (200) preferred orientation were better than the (111) oriented films.
The change in the film orientation was explained by the adsorption model.