無電解銅めっき液の分極挙動と析出物の電子線解析

抄録

Polarization behavior of an electroless copper plating solution containing EDTA as a complexing agent has been studied and the composition, surface appearance and cross section of the deposits have been investigated by electron diffraction analysis At 70°C, polarization behavior was explicable by the mixed potential theory at low concentrations of HCHO and copper complex ion CuY^2- was found to be directly reduced to metallic copper The electron diffraction analysis of the deposit showed the deposition of Cu alone At 70°C and high concentrations of HCHO, however, the additivity of the polarization curves did not hold
A two-step reduction of CuY^2- took place, resulting in the codposition of Cu₂O This is explained by the hypothesis that the alcoholate ion from the HCHO was adsorbed on the working electrode. The results obtained at 70°C and high concentrations of HCHO, were found to hold true also at 30°C The codposition of Cu₂O influenced the surface appearance and cross section of the deposits