抄録
Ni-P-SiC and Ni-P-diamond composite films were formed by electroless plating under various plating conditions, and the content of codeposited SiC or diamond particles was measured by membrane filtration. The effect of the suspension concentration of the dispersed particles and the flow volume of air bubbling on the content of codeposition was estimated. AC impedance was measured at the rest potential in the electroless plating solution, and based on the Cole-Cole plot and Faraday impedance plot, a codeposition mechanism is suggested. The effect of the addition of Tl+ was also evaluated by this impedance method
