無電解めっきによるスズ皮膜の形成
1993 年 44 巻 11 号 p. 966-971
詳細
1993 年 44 巻 11 号 p. 966-971
Electroless tin plating on nickel was investigated in baths using titanium trichloride as a reducing agent and sodium carbonate as the pH controller, and it was confirmed that bright, high-density coatings could be deposited rapidly at optimum conditions of pH 6.5∼7.5 and 50∼70°C.
A typical bath contained 0.08M stannous chloride, 0.09M disodium EDTA, 0.10M NTA, 0.24M trisodium citrate, 0.04M titanium trichloride, and sodium carbonate for pH control.
It was found that this process is also applicable to plating on copper and nonmetallic substrates, and is suitable for making tin films with far better solderability than those made using ammonium hydroxide as the pH controller.
