抄録
An investigation has been conducted into the electrodeposition of Nb-Sn alloy from ambient temperature molten salt electrolytes of an SnCl2-NbCl5-BPC (1-butylpyridinium chloride) system and an Sn-NbCl5-BPC system. The two component base electrolytes of NbCl5-BPC were first investigated, then three component systems were done.
The deposition of Nb-Sn alloy was possible from an NbCl5-BPC melt with SnCl2. An Nb-Sn alloy containing 14.8wt%Nb was deposited from a 53.8mol%SnCl2-7.7mol%NbCl5-38.5mol%BPC bath at 5mA·cm-2 and 130°C. The Nb-Sn alloy deposited from the NbCl5-BPC melt with Sn metal contained a higher weight percent Nb content than that deposited from the NbCl5-BPC melt with SnCl2. The Nb content increased by increasing the NbCl5 concentration in the melt. An Nb-Sn alloy containing 27.9wt%Nb was deposited from the 7.7mol%Sn-15.4mol% NbCl5-76.9mol%BPC bath at 40mA·cm-2 and 130°C.
