抄録
This paper describes an experimental study of a particle removal mechanism in ultrasonic cleaning used in the electronic device manufacturing process. The results are stated briefly as follows;
(1) In ultrasonic cleaning, the scrubbing action of resonant bubbles removes particles.
(2) Neither the cleaning mechanism nor ability depend on ultrasonic frequency from 37kHz to 1MHz.
(3) Ultrasonic cleaning effectively removes perticles larger than 0.2μm in diameter.
