抄録
Dendrite growth and the method of preventing the dendrite growth in nickel electroplating were studied on photochemically etched patterns of vapor depositing copper using a 99.99mass% (4N) copper source.
Soft chemical etching and increasing the plating power source ripple were found to be effective in preventing the dendrite growth. No dendrite growth with copper pattern formed using a 6N copper source or rolled or electrodeposited copper foil. It was found that copper patterns formed with a 6N copper source had higher resistivity in high temperature and high humidity testing than patterns formed with a 4N copper source.
