抄録
Adhesion strength between flat copper and epoxy resin was studied by forming sulfur codeposited copper films or sulfide films on the flat copper surface, with the following results:
1. Copper films from an electroless coper plating bath with sodium sulfide strongly adhered to epoxy resin. Adhesion strength was particularly improved by adding over 100ppm sodium sulfide tothe plating bath.
2. The formation of sulfide films on the copper surface using sodium sulfide solution also effectively improved adhesion. Triazine dithiole treatment also showed a similar effect.
