金有機化合物のレーザ熱分解によるグレーズドアルミナ基板上の配線パターン形成

抄録

A gold organic compound coated on glazed alumina substrates was thermally decomposed by irradiation of a continuous-wave argon ion laser, and the effects of laser power density and scan speed on formed gold line features, geometry, and electrical resistivity were studied. Laser irradiation at a power density of 0.9-1.9kW/cm² and a scan rate of 25μm/s produced a smooth, flat gold line. Lines were about 0.3μm thick, whereas the initial compound layer was about 7μm thick. Electrical resistivity was about 10μΩ·cm, which was a little higher than that of bulk gold, probably due to a small amount of additive impurities for promoting adhesion. Even under these optimum power densities, when the scan rate exceeded 100μm/s, a flow pattern appeared on the line surface. When the scan rate was increased and substrates ware heated and cooled more quickly, cracks were induced in the glaze layer due to thermal expansion. At power densities higher than 2kW/cm², severe cracking occurred and gold vaporized.