スルファミン酸塩浴からのCu/Ni多層膜の作製
1999 年 50 巻 2 号 p. 208-211
詳細
1999 年 50 巻 2 号 p. 208-211
Cu/Ni multilayers were deposited on a rotating disk electrode by galvanostatic pulse electrolysis in a bath containing 1mol/L nickel sulfamate, 0.005mol/L copper sulfamate, and 0.49mol/L boric acid at pH4.0 and 50°C. The Cu deposition current density was 0.8 times the limiting one to avoid dendritic growth. Ni was deposited at a current density of 15A/dm2. Cu/Ni multilayers were deposited with (111) preferred orientation on the stainless steel substrate with (110) preferred orientation.
